Diffusion Bonding
Benefits of HIP Diffusion Bonding
The preferred method of joining high temperature materials
is by diffusion bonding which can be accomplished with Hot Isostatic Processing.
HIP can create essentially perfect diffusion bonds. In the HIPing industry
of today 100% bonds are routine. The simultaneous application of heat and
isostatic gas pressure combine to collapse bonds and porosity by creep
mechanisms and to "heal" the material by diffusion bonding the material
together. A very significant aspect of the HIP process in the marked reduction
in the statistical spread or scatter.
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Improved wear and corrosion layers
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Creates high strength bonds
- Similar and dissimilar materials
- Metal to metal; ceramics to metal; composites to other metals
- Interlayers may be required
- High reliability joints
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Interface
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Mechanical properties
- Create unique micro-structures
- Solid, powder, or both materials may be used
- Simultaneously densify and bond to substrate
- Vastly different mechanical properties
- Approach parent material with similar materials
- Lower processing temperature
- No melting of parent metal
- No associated defects
- Segregation
- Solidification Cracking
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Engineered alloys for specific environments
- Complex geometries
- Micro composites
- Metal or Ceramic matrix (MMC’s/CMC’s)
- Combinations
- Al w/ Carbon or Boron Fiber
- Titanium w/ Carbon Fiber
- Titanium w/ Silicon-Carbon Fiber
- Macro composites
- Improve wear and/or corrosion resisitance
- Increased life reduces downtime
- Apply to less expensive substrates
- Plastic extrusion barrels
- Sputtering targets
- Warheads w/ tungsten particles
- Valve lifters
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HIP pressure can be used to hold complex surfaces in perfect registry
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Cladding may be thick or thin